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Design Capabilities:
- Controlled impedance, Differential pair, Matched length busses.
- High speed Signal Integrity modeling.
- DDR, USB, Fibre Channel, SATA, FireWire, etc.
- Video, Audio, Power, Analog and Digital.
- Microstrip and stripline routing.
- RF, radio and embedded trace antennas.
- FPC (Flex Printed Circuit) Design, fabrication and assembly.
- 26+ PCB layer count
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- Hybrid PCBs with optimum laminates for different dielectric constants and loss.
- Total thickness of the PCB design down to 2 mils thick (.002")
- Trace/Space down to 2 mil (laser etched).
- Non-conductive /conductive epoxy filled Via-in-pad, laser drilled vias, Blind / buried vias, etc.
- Flip Chip On Board (FCOB), Direct Chip Attachment (DCA), Component On Board (COB), Micro-BGA, etc.
- ESD, EMI, EMC countermeasures.
- Microwave modeling.
- Component / Die Parasitic extraction (L,R,C) / Via Modeling.
- Microstrip lumped components modeling.
- S-Parameter / Spice / IBIS model extraction / creation from complex structures and silicon connections to substrates through bonding wires.
- 3D Electromagnetic Field Simulation (FCC radiated emissions).
- RoHS, Lead Free, Mil Spec, IPC-6012 (1-3), etc.
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PCB Fabrication:
- Quick / Rush orders in 1 day.
- Local fabrication for quick turns.
- Overseas for inexpensive large orders.
- RoHS, Lead Free, Mil Spec, IPC, etc.
PCB Assembly Manufacturing:
- Parts / component procurement.
- Complete assembly manufacturing management.
- Quick / Rush orders.
- Local assembly for prototype and qualification runs.
- Overseas for inexpensive large production.
- PCB procurement.
- Completely Lead Free.
PCB design file translation
PCB file translation / conversion services available for translation between Cadence Allegro to Mentor PADS (as well 'other tool' to 'other tool').
Customer / Project diversity
- Long term / complex boards or projects
- Quick / small boards or projects
- Appreciation for the 'small company' start up.
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